Tech Company Financing Transactions

ThinCI Funding Round

DENSO International America, Temasek Holdings and Daimler participated in a $65 million Series C funding round for ThinCI. The financing round was announced on 9/6/2018.

Transaction Overview

Company Information

Company Status

Private & Independent

Industry

Artificial Intelligence

Mailing Address

4659 Golden Foothill Pkwy. 201
El Dorado Hills, CA 95762
USA

Phone

(916) 347-0050

Website

www.thinci.com

Email Address

[email protected]

Overview

ThinCI was created to meet growing consumer demands for new interactive products. We have innovated and patented a set of remarkable new technologies that will bring unheard-of Vision Processing to all types of consumer devices. Next generation products require 10x-100x more performance and longer battery life - and ThinCI is poised to meet those needs.

Profile

Social Media

Company News

Facebook

YouTube

Management Team

Title

Name

Email & Social

Chief Executive Officer

Dinakar Munagala

        

Chief Technical Officer

Satyaki Koneru

        

VP - Engineering

Santiago Gomez

        

VP - Engineering

Ke Yin

        

VP - Operations

Richard Terrill

        

VP - Product Management

Shawn Holiday

        

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Prev: 9/6/2018: The Inside venture capital transaction
Next: 9/6/2018: Roblox venture capital transaction

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Where The Data Comes From

We do our best to record every notable VC transaction. VC investment data records reported here are sourced from news reports and company announcements. The data comes to us via our partnership with VentureDeal.com, an affiliated venture.

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