Tech Company Financing Transactions
Rapidus Funding Round
Rapidus closed a $1.7 billion funding round on 2/27/2026. Investors included Dai Nippon Printing Company, DENSO International America and Development Bank of Japan.
Transaction Overview
Company Name
Announced On
2/27/2026
Transaction Type
Venture Equity
Amount
$1,700,000,000
Round
Undisclosed
Investors
Proceeds Purpose
Rapidus will continue to secure funding through capital increases and loans from both public and private sources.
Company Information
Company Status
Private & Independent
Industry
Manufacturing
Mailing Address
Kojimachi Diamond Bldg., 4-1 Kojimachi, Chiyoda-ku
Tokyo, 102-0083
Japan
Tokyo, 102-0083
Japan
Phone
Undisclosed
Website
Email Address
Not Recorded
Overview
Rapidus Corporation was established in August 2022 to create advanced semiconductor and packaging technologies. Our mission is to improve efficiency, reduce power and improve the ecological impact of advanced computing in datacenters, autonomous vehicles, industrial manufacturing and artificial intelligence. The digital society is advancing rapidly. AI will accelerate the need for more computation in datacenters, cars, factories and in our homes. Semiconductors are an indispensable component for making business more adaptable, communications more reliable, transportation safer, and entertainment more available.
Profile
Social Media
Company News
Facebook
YouTube
Management Team
Title
Name
Email & Social
Chief Executive Officer
Atsuyoshi Koike
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Where The Data Comes From
Our team works diligently to report on funding rounds that are announced publicly. VC investment data records reported here are sourced from company press releases and news coverage. The data is sourced from VentureDeal.com, an affiliated venture.
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