Tech Company Financing Transactions
Rayspan Funding Round
Rayspan closed a $12.5 million Series B investment round on 7/27/2009. Investors included Khosla Ventures and Sequoia Capital.
Transaction Overview
Company Name
Announced On
7/27/2009
Transaction Type
Venture Equity
Amount
$12,500,000
Round
Series B
Investors
Khosla Ventures (Pierre Lamond)
Sequoia Capital (Mark Stevens)
Proceeds Purpose
Proceeds purposes were not disclosed.
Company Information
Company Status
Out of Business
Industry
Wireless
Mailing Address
11975 El Camino Real 301
San Diego, CA 92130
USA
San Diego, CA 92130
USA
Phone
Website
Email Address
Overview
Rayspan Corporation is the world's leading innovator of revolutionary metamaterial air interface solutions for high performance wireless communication networks. Metamaterials are emerging as the most important advance in air interface technology in decades. They exhibit electromagnetic properties not found in natural media that enable breakthrough improvements in communication system performance.
Profile
Social Media
Company News
Facebook
YouTube
Management Team
Title
Name
Email & Social
Chief Executive Officer
Franz Birkner
Co-Founder
Maha Achour
VP - Bus. Development
Gregory Poilasne
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Where The Data Comes From
We do our best to record every notable VC transaction. VC investment data records reported here are sourced from news reports and company announcements. The information is sourced from VentureDeal.com, an affiliated venture.
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