Tech Company Financing Transactions
TeleCIS Wireless Funding Round
TeleCIS Wireless closed a $10 million Series C funding round on 1/17/2006. Investors included ATA Ventures.
Transaction Overview
Company Name
Announced On
1/17/2006
Transaction Type
Venture Equity
Amount
$10,000,000
Round
Series C
Investors
ATA Ventures (Lead Investor) (Hatch Graham)
Proceeds Purpose
This round of funding will support the upcoming launch of the company's performance leading WiMAX Fixed/Portable subscriber device chip as well as the development of the second TeleCIS chip, a multi-protocol chipset combining 802.16e WiMAX Mobile and 802.11 WiFi protocols in a single chip.
Company Information
Company Status
Out of Business
Industry
Semiconductors
Mailing Address
42 West Campbell Ave 202
Campbell, CA 95008
USA
Campbell, CA 95008
USA
Phone
Website
Email Address
Overview
TeleCIS Wireless, Inc. is a Silicon Valley-based, fabless semiconductor company dedicated to delivering multi-protocol wireless System-on-a-Chip (SoC) solutions to the Broadband Wireless Communications industry.
Profile
Social Media
Company News
Facebook
YouTube
Management Team
Title
Name
Email & Social
Chief Executive Officer
Mike Hodges
Chief Operating Officer
David Sumi
VP - Bus. Development
Brandon Amber
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