Tech Company Financing Transactions
Capcon Singapore Funding Round
Capcon Singapore closed a $50 million Series B financing round on 2/6/2023. Investors included private investors.
Transaction Overview
Company Name
Announced On
2/6/2023
Transaction Type
Venture Equity
Amount
$50,000,000
Round
Series B
Investors
Proceeds Purpose
The company intends to use the funds to invest in manufacturing, marketing, and R&D.
Company Information
Company Status
Private & Independent
Industry
Manufacturing
Mailing Address
1 North Coast Avenue #05-03/04, Woodlands North Coast,
Singapore, 737663
SG
Singapore, 737663
SG
Phone
Website
Email Address
Overview
Registered in 2014, Capcon Limited is an equipment manufacturer aiming to provide high end products and innovative solutions to the advanced semiconductor assembly and packaging industry. Our current global services are at Singapore, Taiwan, Philipine, Beijing. Driven by the strong market demand on advanced assembly and packaging process, Capcon provides unique solutions with state of art technologies by our excellent team . Our product line is well reputed among ASE,SPIL,TSMC,AMD,TFME,JCET,DeeTee,etc. Process covers FOWLP(Face Up/Down),POP,MCM,EMCP,Stack Die,SiP,2.5D/3D,FCCSP,FCBGA,etc.
Profile
Social Media
Company News
Facebook
YouTube
Management Team
Title
Name
Email & Social
Co-Founder
Yu Feng
Co-Founder
Wang Hongbo
Co-Founder
Wang Honggang
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