Tech Company Financing Transactions
Conduit Funding Round
Conduit secured a $6 million Seed funding round on 3/24/2026. Investors included Innovation Endeavors and Y Combinator.
Transaction Overview
Company Name
Announced On
3/24/2026
Transaction Type
Venture Equity
Amount
$6,000,000
Round
Seed
Investors
Innovation Endeavors (Lead Investor) (Harpinder Singh)
Proceeds Purpose
The round will accelerate Conduit's mission to replace manual shipping and receiving systems with AI-powered workflows.
Company Information
Company Status
Private & Independent
Industry
Transportation
Mailing Address
2261 Market St
San Francisco, CA 94114
USA
San Francisco, CA 94114
USA
Phone
Undisclosed
Website
Email Address
Overview
We make software for warehouses and logistics teams to save time and money managing docks, gates, and yards. With dock, gate, and yard management modules, each module can easily be added on or used on its own. This makes Conduit the perfect fit for all types of operations. Best of all, if you have multiple facilities then Conduit can be configured differently at each facility, but provide you with a comprehensive view of your entire network. We are proud to be able to help supply chains of all sizes optimize their labor, increase throughput, and prepare for the work ahead.
Profile
Social Media
Company News
Facebook
YouTube
Management Team
Title
Name
Email & Social
Chief Executive Officer
Conrad Lilleness
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