Tech Company Financing Transactions
Nexstrom Funding Round
On 9/22/2026, Nexstrom raised $12 million in Seed financing from Xora Innovation, Foothill Ventures and Seeds Capital.
Transaction Overview
Company Name
Announced On
9/22/2026
Transaction Type
Venture Equity
Amount
$12,000,000
Round
Seed
Investors
Proceeds Purpose
The company intends to use the funds to accelerate the commercialization of its platform, support ongoing platform development, enter into strategic collaborations with semiconductor foundries, and expand its engineering and leadership teams.
Company Information
Company Status
Private & Independent
Industry
Semiconductors
Mailing Address
1 Create Wy, Campus for Research Excellence and Technologica
Singapore, 138602
Singapore
Singapore, 138602
Singapore
Phone
Undisclosed
Website
Email Address
Overview
Next-generation AI infrastructure demands unprecedented transistor density without compromising energy efficiency. As silicon approaches its scaling limit, foundries face a critical bottleneck: The industry lacks the production tools to grow 2D materials on standard 12-inch wafers at commercially viable yields.
Profile
Social Media
Company News
Facebook
YouTube
Management Team
Title
Name
Email & Social
Chief Executive Officer
Phoebe Tan
Chief Scientific Officer
Lance Li
VP - Administration
Chin Fai
VP - Engineering
Sung-Yen Wei
VP - R & D
Jing-Kai Huang
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