Tech Company Financing Transactions
Conduit Funding Round
On 4/10/2025, Conduit received $3.1 million in Seed funding from Pi Labs, private investors and Y Combinator.
Transaction Overview
Company Name
Announced On
4/10/2025
Transaction Type
Venture Equity
Amount
$3,100,000
Round
Seed
Investors
Proceeds Purpose
The seed funding will support product development and accelerate growth into new markets.
Company Information
Company Status
Private & Independent
Industry
Software
Mailing Address
1097 Howard Street
San Francisco, CA 94103
USA
San Francisco, CA 94103
USA
Phone
Undisclosed
Website
Email Address
Not Recorded
Overview
Customer conversations are the backbone of every business. In housing and hospitality, communication is the operation. Every part of the business--leasing, scheduling, support--starts with a conversation. At Conduit, we're building the AI infrastructure for conversation-first businesses, starting with the built world.
Profile
Social Media
Company News
Facebook
YouTube
Management Team
Title
Name
Email & Social
Chief Executive Officer
Cole Rubin
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