Tech Company Financing Transactions

1366 Technologies Funding Round

1366 Technologies closed a $2.5 million Series C financing round on 12/12/2013. Backers included Vorndran Mannheims Capital.

Transaction Overview

Company Name
Announced On
12/12/2013
Transaction Type
Venture Equity
Amount
$2,500,000
Round
Series C
Proceeds Purpose
Proceeds purposes were not disclosed.

Company Information

Company Status
Private & Independent
Industry
Alternative Energy
Mailing Address
6 Preston Ct.
Bedford, MA 01730
USA
Email Address
Overview
Solving Silicon PV's Cost Barrier -- Silicon PV wafers comprise 50% of the cost of a module and limit manufacturers' cell efficiencies due to bulk quality and surface non-uniformities. 1366's one-step Direct Wafer process solves these quality and cost barriers by providing manufacturers with a uniformly better wafer produced for a fraction of the cost.
Profile
1366 Technologies LinkedIn Company Profile
Social Media
1366 Technologies Company Twitter Account
Company News
1366 Technologies News
Facebook
1366 Technologies on Facebook
YouTube
1366 Technologies on YouTube

Management Team

Title
Name
Email & Social
Chief Executive Officer
Frank Van Mierlo
  Frank Van Mierlo LinkedIn Profile  Frank Van Mierlo Twitter Account  Frank Van Mierlo News  Frank Van Mierlo on Facebook


 

 

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