Tech Company Financing Transactions
Teramount Funding Round
Teramount, based in Jerusalem, received $50 million from Koch Disruptive Technologies, AMD and Grove Ventures.
Transaction Overview
Company Name
Announced On
7/29/2025
Transaction Type
Venture Equity
Amount
$50,000,000
Round
Undisclosed
Investors
Proceeds Purpose
The company intends to use the funds to grow its team and scale to volume production, ahead of the market adoption of CPO (co-packaged optics).
Company Information
Company Status
Private & Independent
Industry
Telecom
Mailing Address
18 Hartom St.
Jerusalem, Undisclosed
Israel
Jerusalem, Undisclosed
Israel
Phone
Undisclosed
Website
Email Address
Overview
Teramount changes the world of optical connectivity by offering a novel solution, the patented Universal Photonic Coupler, for connecting optics to silicon. Teramount's Universal Photonic Coupler utilizes standard semiconductor manufacturing processes and packaging flow in silicon photonics, enabling any fabless semiconductor company to expand into silicon photonics while working with traditional foundries and OSATs.
Management Team
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