Tech Company Financing Transactions

Inpria Funding Round

Samsung Ventures, Applied Ventures and Intel Capital participated in a $23.5 million Series B funding round for Inpria. The round was announced on 7/11/2017.

Transaction Overview

Company Name
Announced On
7/11/2017
Transaction Type
Venture Equity
Amount
$23,500,000
Round
Series B
Investors

Samsung Ventures (Lead Investor) (Dong-Su Kim)

Applied Ventures

Intel Capital (Wendell Brooks)

JSR Corporation

Proceeds Purpose
Fueled by growing customer demand, Inpria will use the funds to complete its pilot manufacturing facility and to commence commercial production.

Company Information

Company Status
Private & Independent
Industry
Advanced Materials
Mailing Address
1100 NE Circle Blvd. 360
Corvallis, OR 97330
USA
Email Address
Overview
Inpria Corporation extends semiconductor lithography with inorganic photoresists and other thin films for nanoscale patterning.
Profile
Inpria LinkedIn Company Profile
Social Media
Inpria Company Twitter Account
Company News
Inpria News
Facebook
Inpria on Facebook
YouTube
Inpria on YouTube

Management Team

Title
Name
Email & Social
Chief Executive Officer
Andrew Grenville
  Andrew Grenville LinkedIn Profile  Andrew Grenville Twitter Account  Andrew Grenville News  Andrew Grenville on Facebook


 

 

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About Database of VC Transactions

Our team works diligently to report on tech company VC transactions. VC investment data records on this site are sourced from a variety of public sources. The data is sourced from VentureDeal.com, an affiliated venture.

 


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