Tech Company Financing Transactions
TelASIC Communications Funding Round
TelASIC Communications, operating out of El Segundo, secured $35 million from Fuse Capital, Mission Ventures and Raytheon Company.
Transaction Overview
Company Name
Announced On
10/2/2003
Transaction Type
Venture Equity
Amount
$35,000,000
Round
Series C
Investors
Proceeds Purpose
Funds from the investment will be used to aggressively market TelASIC's family of ICs and its BaseFlex chipset.
Company Information
Company Status
Out of Business
Industry
Semiconductors
Mailing Address
1940 East Mariposa Avenue 100
El Segundo, CA 90245
USA
El Segundo, CA 90245
USA
Phone
Website
Email Address
Overview
TelASIC's TC8201 Linearized Transmit Hardware Platform can be used by OEMs to connect to any PA and deliver Linearized MCPA, Integrated or Remote Radio Head for HSDPA/ WCDMA and EVDO/ cdma2000 base stations
Profile
Social Media
Company News
Facebook
YouTube
Management Team
Title
Name
Email & Social
Chief Executive Officer
Prabhat Dubey
Vice President
Khiem Cai
VP - Manufacturing
Kent Osborne
VP - Product Management
Wilhelm Heger
VP - Sales
Ashis Khan
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