OpenLight Funding Round

4/28/2026

Venture Equity

$50,000,000

Series A

The company intends to use the funds to accelerate advancement of its broad III-V heterogeneous integration platform, including leading-edge 400G modulators and on-chip laser and optical amplifier technology.

Private & Independent

Manufacturing

6868 Cortona Drive C
Goleta, CA 93117
USA

OpenLight's PASIC technology integrates all the components of silicon photonics devices into one photonic integrated circuit. The active components, such as lasers, modulators and optical amplifiers are coupled within the silicon photonics chip to 'passive' components, such as waveguides, splitters and receivers. They are all integrated into the same silicon photonics chip and only require coupling out of the chip for integration into their intended application. This single chip concept vastly reduces manufacturing and assembly costs, by removing less reliable manufacturing processes altogether, such as aligning external lasers to waveguides.